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| Device / variant | Symbol | Package | Action | |
|---|---|---|---|---|
device: BC118 library: blue-creation-bc118.lbr | BC118 is a highly flexible, ultra low power, small form factor Bluetooth Version 4.0 Certified module. Bluetooth Certified 4.0 Audio module Single Mode: Bluetooth Low Energy (BLE) Embedded Bluetooth Protocol Stack Supports GATT Profile, Audio, Proximity, and iBeacon Supports I2C and UART transparent Data Modes Simple UART and GPIO interface for command and control Small form factor (14.4mm x 19.3mm x 2.2mm) Bluetooth, FCC and CE certified The library has been designed ... | Download NowShow Library | ||
variants: | symbol: BC118  | package: BC118  | Show Device | |
device: BC358239A library: csr.lbr | BlueCore TM 3-Multuimedia Single Chip Bluetooth® v1.2 System Auto generated by make-symbol-device-package-bsdl.ulp Rev. 19 Source: http://www.csrsupport.com/download/1796/CS-101560-DSP1%20BlueCore3-Multimedia%20Product%20Data%20Sheet.pdf | Download NowShow Library | ||
variants: | symbol: BC358239A  | package: LFBGA96  | Show Device | |
device: BLUEGIGA_WT11 library: m-pad-2.1.lbr | BlueGiga's WT11 Bluetooth Module (2.0+EDR) Description: BlueCore4 is a single chip Bluetooth solution which implements the Bluetooth radio transceiver and also an on chip microcontroller. BlueCore4 implements Bluetooth® 2.0+EDR (Enhanced Data Rate) and it can deliver data rates up to 3 Mbps. The microcontroller (MCU) on BlueCore04 acts as interrupt controller and event timer run the Bluetooth software stack and control the radio and host interfaces. A 16-bit reduced instruction set comp ... | Download NowShow Library | ||
variants: | symbol: BLUEGIGA_WT11  | package: WT11  | Show Device | |
device: BLUEGIGA_WT12 library: m-pad-2.1.lbr | BlueGiga's WT12 Bluetooth Module (2.0+EDR) Description: BlueCore4 is a single chip Bluetooth solution which implements the Bluetooth radio transceiver and also an on chip microcontroller. BlueCore4 implements Bluetooth® 2.0+EDR (Enhanced Data Rate) and it can deliver data rates up to 3 Mbps. The microcontroller (MCU) on BlueCore04 acts as interrupt controller and event timer run the Bluetooth software stack and control the radio and host interfaces. A 16-bit reduced instruction set comp ... | Download NowShow Library | ||
variants: | symbol: BLUEGIGA_WT12  | package: WT12  | Show Device | |
device: BR-C30A library: m-pad-2.1.lbr | Blue Radio's BR-C30 Class1, Class2, and Class3 Bluetooth® ver1.2 OUTLINE: AT HOME. AT WORK. ON THE ROAD. USING BLUETOOTH WIRELESS TECHNOLOGY MEANS TOTAL FREEDOM FROM THE CONSTRAINTS AND CLUTTER OF WIRES IN YOUR LIFE. Wireless communications module certified to Bluetooth® v1.2. Two types of models: With/without ceramic RF chip antenna provided. FCC, CE, Industry Canada, RoHS, and Bluetooth® certified ISM 2.4GHz band module. UART data, and PCM audio interfaces available to various appli ... | Download NowShow Library | ||
variants: | symbol: BR-C30A  | package: BR-C30A  | Show Device | |
device: BTM-110-112 library: rayson__btm_bluetooth_modul.lbr | The module is a Max.4dBm( Class2 ) module. Bluetooth standard Ver. 2.0 + EDR conformity. Internal 1.8V regulator Low current consumption : Hold,Sniff,Park,Deep sleep Mode 3.0v to 3.6v operation Support for up to seven slaves : SCO links,ACL links,Piconet Interface: USB,UART&PCM(for voice CODEC) SPP firmware with AT command sets Small outline. 25 x 14.5 x 2.2 mm | Download NowShow Library | ||
variants: | symbol: BTM-110-112  | package: BTM-112  | Show Device | |
device: BTM-180 library: rayson__btm_bluetooth_modul.lbr | The module is a Max.4dBm( Class2 ) module with antenna Bluetooth standard Ver. 2.0 + EDR compliant. Low current consumption : Hold,Sniff,Park,Deep sleep Mode 3.0V or 1.8V operation Support for up to seven slaves : SCO links,ACL links,Piconet Interface: USB,UART&PCM(for voice CODEC) HCI or SPP,HSP/HFP,HID,DUN firmware is available Support for 802.11 Co-Exsitence RoHS compliant Small outline. 25.0 x 14.5 x 2.2 mm | Download NowShow Library | ||
variants: | symbol: BTM-180  | package: BTM-180  | Show Device | |
device: BTM-220-222 library: rayson__btm_bluetooth_modul.lbr | Rayson BTM-222 Bluetooth Modul all Pins | Download NowShow Library | ||
variants: | symbol: BTM-220-222  | package: BTM-220-222  | Show Device | |
device: BTM-220-222-SERIAL library: rayson__btm_bluetooth_modul.lbr | Rayson BTM-222 Bluetooth Modul Serial Pins | Download NowShow Library | ||
variants: | symbol: BTM-220-222-SERIAL  | package: BTM-220-222 | Show Device | |
device: BTM-222 library: btm-222.lbr | Rayson BTM-222 Bluetooth Modul all Pins | Download NowShow Library | ||
variants: | symbol: BTM-222  | package: BTM-222  | Show Device | |
device: BTM-222-SERIAL library: btm-222.lbr | Rayson BTM-222 Bluetooth Modul Serial Pins | Download NowShow Library | ||
variants: | symbol: BTM-222-SERIAL  | package: BTM-222 | Show Device | |
device: BTM-230 library: rayson__btm_bluetooth_modul.lbr | BC04-EXT Class1 Module The module is a Max.17dBm( Class1 ) module. Bluetooth v2.0+EDR system. 3.0V to 3.6V operation Interface: USB, UART&PCM( for voice codec) Integrated with 8M bits flash memory. Integrated chip antenna SPP firmware with AT commands RoHS compliant. Small outline. 35.3 x 14 x 2.5 mm. | Download NowShow Library | ||
variants: | symbol: BTM-230  | package: BTM-230  | Show Device | |
device: BTM-240/250 library: rayson__btm_bluetooth_modul.lbr | BC03-mm Class1 Stereo Module The module is a Max.18dBm( Class1 ) module. Bluetooth standard Ver. 2.0 conformity. Low current consumption 3.0V or 1.8V operation Embedded Kalimba DSP Co-Processor Integrated 16-bit Stereo Audio CODEC Scatternet Support Interface: USB,UART&PCM(for voice CODEC) Support Digital Audio Bus : I2S or SPDIF Headset/Handsfree firmware is available A2DP/AVRCP profile support RoHS compliant Small outline. 16 x 14 x 2.0 mm | Download NowShow Library | ||
variants: | symbol: BTM-240/250  | package: BTM-240/250  | Show Device | |
device: BTM-331 library: rayson__btm_bluetooth_modul.lbr | Bluetooth ®Module Class2 BC04-rom HCI Module | Download NowShow Library | ||
variants: | symbol: BTM-331  | package: BTM-331  | Show Device | |
device: BTM-620 library: rayson__btm_bluetooth_modul.lbr | The module is a Max.18dBm( Class 1 ) module. Bluetooth Standard v2.1+EDR. Integrated Switched-Mode Regulator. Integrated Battery Charger. Embedded Kalimba DSP Co-Processor. Integrated 16-bit Stereo Audio CODEC 95dB SNR for DAC. Enhanced Audibility and Noise Cancellation. Integrated with 8M bits flash memory. Support Host Interface: USB or UART. Support Digital Audio Bus : PCM, I2S or SPDIF. HSP/HFP/A2DP/AVRCP profiles support. RoHS compliant. Small outline. 21 x 16 x 2 mm. | Download NowShow Library | ||
variants: | symbol: BTM-620  | package: BTM-620  | Show Device | |
device: BTM-720 library: rayson__btm_bluetooth_modul.lbr | The module is a Max.4dBm( Class2 ) module. Fully Qualified Bluetooth v2.0+EDR system. Integrated Switched-Mode Regulator. Integrated Battery Charger. Embedded Kalimba DSP Co-Processor. Integrated 16-bit Stereo Audio CODEC 95dB SNR for DAC. Enhanced Audibility and Noise Cancellation. Integrated with 16M bits flash memory. Support Host Interface: USB or UART. Support Digital Audio Bus : PCM, I2S or SPDIF. HSP/HFP/A2DP/AVRCP profiles support. RoHS compliant. Small outline. 16 x 15 x ... | Download NowShow Library | ||
variants: | symbol: BTM-720  | package: BTM-720-730-740  | Show Device | |
device: BTM-730/740 library: rayson__btm_bluetooth_modul.lbr | The module is a Max.4dBm( Class2 ) module. Fully Qualified Bluetooth v2.0+EDR system. Integrated Switched-Mode Regulator. Integrated Battery Charger. Embedded Kalimba DSP Co-Processor. Integrated 16-bit Stereo Audio CODEC 95dB SNR for DAC. Enhanced Audibility and Noise Cancellation. Integrated with 8M bits flash memory. Support Host Interface: USB or UART. Support Digital Audio Bus : PCM, I2S or SPDIF. HSP/HFP/A2DP/AVRCP profiles support. RoHS compliant. Small outline. 16 x 15 x ... | Download NowShow Library | ||
variants: | symbol: BTM-730/740  | package: BTM-720-730-740 | Show Device | |
device: BTM-750 library: rayson__btm_bluetooth_modul.lbr | The module is a Max.4dBm( Class2 ) module. Fully Qualified Bluetooth v2.1+EDR system. Integrated Switched-Mode Regulator. Integrated Battery Charger. Embedded Kalimba DSP Co-Processor. Integrated 16-bit Stereo Audio CODEC 95dB SNR for DAC. Enhanced Audibility and Noise Cancellation. Integrated with 8M bits flash memory. Support Host Interface: USB or UART. Support Digital Audio Bus : PCM, I2S or SPDIF. HSP/HFP/A2DP/AVRCP profiles support. Integrated chip antenna ( or W.FL connecto ... | Download NowShow Library | ||
variants: | symbol: BTM-750  | package: BTM-750  | Show Device | |
device: CC2540 library: texas.lbr | 2.4-GHz Bluetooth® low energy System-on-Chip Auto generated by make-symbol-device-package-bsdl.ulp Rev. 39 Source: cc2540.txt | Download NowShow Library | ||
variants: | symbol: CC2540  symbol: EXP-16  | package: QFN40-6X6  | Show Device | |
device: CC2540F* library: _hhn_CC2540F_BluetoothSOC_r500.lbr | CC2540F128 / CCF254F256 Texas Instruments 2.4-GHz Bluetooth® low Energy System-on-Chip Package: QFN406x6mm (TI-Postifx "RHA") Dipl.-Ing. FH Rainer Bayer Hochschule Heilbronn – rainer.bayer@hs-heilbronn.de Ingenieurbüro ing-rb – eagle@ing-rb.de | Download NowShow Library | ||
variants: | symbol: CC2540F128_F256  | package: QFN40-6X6  | Show Device | |
device: CC2541 library: texas-cc2541.lbr | The CC2541 is a power-optimized true system-on-chip (SoC) solution for both Bluetooth low energy and proprietary 2.4-GHz applications. It enables robust network nodes to be built with low total bill-of-material costs. The CC2541 combines the excellent performance of a leading RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8-KB RAM, and many other powerful supporting features and peripherals. The library has been designed by Richard Magdycz | Download NowShow Library | ||
variants: | symbol: CC2541  | package: QFN40-6X6  | Show Device | |
device: GSX-211 library: golledge.lbr | Crystal |SM| 1.6 x 1.2 x 0.45mm | Frequency Range: 24.0-54.0MHz Ultra-miniature for maximum space saving Ideal for Bluetooth, NFC, Smartcard, wireless, wearables etc Metal lid grounded to minimise EMI Seam sealed for excellent long-term stability Datasheet and Purchasing Information | Download NowShow Library | ||
variants: | symbol: Q4PIN  | package: GSX-211  | Show Device | |
device: GSX-211 library: golledge_full_v1-0.lbr | Crystal |SM| 1.6 x 1.2 mm | AT cut | Frequency Range 24 - 54 MHz Ultra-miniature for maximum space saving Ideal for Bluetooth, NFC, Smartcard, wireless etc Metal lid grounded to minimise EMI Seam sealed for excellent long-term stability Datasheet | Download NowShow Library | ||
variants: | symbol: Q4PIN  | package: GSX-211  | Show Device | |
device: GSX-211 library: golledge_jun16a.lbr | Crystal |SM| 1.6 x 1.2 mm | AT cut | Frequency Range 24 - 54 MHz Ultra-miniature for maximum space saving Ideal for Bluetooth, NFC, Smartcard, wireless etc Metal lid grounded to minimise EMI Seam sealed for excellent long-term stability Datasheet | Download NowShow Library | ||
variants: | symbol: Q4PIN  | package: GSX-211  | Show Device | |
device: GSX-213 library: golledge_jun16a.lbr | Crystal |SM| 1.6 x 1.2 mm | AT cut | Frequency Range 26 - 60 MHz Ultra-miniature for maximum space saving Ideal for Bluetooth, NFC, Smartcard, wireless etc Metal lid grounded to minimise EMI Seam sealed for excellent long-term stability Datasheet | Download NowShow Library | ||
variants: | symbol: Q4PIN | package: GSX-211 | Show Device | |
device: GSX-221 library: golledge.lbr | Crystal |SM| 2.0 x 1.6 x 0.55mm | Frequency Range: 16.0 - 56.0MHz Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications High reliability & tight stability Metal lid can be grounded to minimise EMI Seam sealed for excellent long-term stability Datasheet and Purchasing Information | Download NowShow Library | ||
variants: | symbol: Q4PIN | package: GSX-221  | Show Device | |
device: GSX-221 library: golledge_full_v1-0.lbr | Crystal |SM| 2.0 x 1.6 mm | AT cut | Frequency Range 16 - 56 MHz Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications High reliability & tight stability Metal lid can be grounded to minimise EMI Seam sealed for excellent long-term stability Datasheet | Download NowShow Library | ||
variants: | symbol: Q4PIN | package: GSX-221  | Show Device | |
device: GSX-221 library: golledge_jun16a.lbr | Crystal |SM| 2.0 x 1.6 mm | AT cut | Frequency Range 16 - 56 MHz Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications High reliability & tight stability Metal lid can be grounded to minimise EMI Seam sealed for excellent long-term stability Datasheet | Download NowShow Library | ||
variants: | symbol: Q4PIN | package: GSX-221  | Show Device | |
device: GSX-223 library: golledge_jun16a.lbr | Crystal |SM| 2.0 x 1.6 mm | AT cut | Frequency Range 16 - 50 MHz Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications Metal lid can be grounded to minimise EMI Seam sealed for excellent long-term stability Datasheet | Download NowShow Library | ||
variants: | symbol: Q4PIN | package: GSX-221 | Show Device | |
device: GSX-321 library: golledge_full_v1-0.lbr | Crystal |SM| 2.5 x 2.0 mm | AT cut | Frequency Range 12 - 66 MHz Tight specification / wide temperature option Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications Metal lid grounded to minimise EMI Seam sealed for excellent long-term stability Datasheet | Download NowShow Library | ||
variants: | symbol: Q4PIN | package: OSC2520  | Show Device | |
device: GSX-321 library: golledge_jun16a.lbr | Crystal |SM| 2.5 x 2.0 mm | AT cut | Frequency Range 12 - 66 MHz Tight specification / wide temperature option Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications Metal lid grounded to minimise EMI Seam sealed for excellent long-term stability Datasheet | Download NowShow Library | ||
variants: | symbol: Q4PIN | package: OSC2520  | Show Device | |
device: GSX-323 library: golledge_jun16a.lbr | Crystal |SM| 2.5 x 2.0 mm | AT cut | Frequency Range 12 - 54 MHz Ideal for Bluetooth / Wireless applications Seam sealed for excellent long-term stability Ultra-miniature for maximum space saving Metal lid grounded to minimise EMI Datasheet | Download NowShow Library | ||
variants: | symbol: Q4PIN | package: OSC2520 | Show Device | |
device: GSX-333 library: golledge_jun16a.lbr | Crystal |SM| 3.2 x 2.5 mm | AT cut | Frequency Range 12 - 125 MHz Metal lid can be grounded to minimise EMI Seam sealed for excellent long-term stability Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications Datasheet | Download NowShow Library | ||
variants: | symbol: Q4PIN | package: OSC3225  | Show Device | |
device: GSX-431 library: golledge_full_v1-0.lbr | Crystal |SM| 4.0 x 2.5 mm | AT cut | Frequency Range 13 - 32 MHz Metal lid can be grounded to minimise EMI Seam sealed for excellent stability Ultra-miniature for maximum space saving Ideal for Bluetooth applications Datasheet | Download NowShow Library | ||
variants: | symbol: Q4PIN | package: GSX-431  | Show Device | |
device: GSX-431 library: golledge_jun16a.lbr | Crystal |SM| 4.0 x 2.5 mm | AT cut | Frequency Range 13 - 32 MHz Metal lid can be grounded to minimise EMI Seam sealed for excellent stability Ultra-miniature for maximum space saving Ideal for Bluetooth applications Datasheet | Download NowShow Library | ||
variants: | symbol: Q4PIN | package: GSX-431  | Show Device | |
device: GSX-433 library: golledge_jun16a.lbr | Crystal |SM| 4.0 x 2.5 mm | AT cut | Frequency Range 12 - 44 MHz Good frequency perturbation Metal lid can be grounded to minimise EMI Seam sealed for excellent stability Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications Datasheet | Download NowShow Library | ||
variants: | symbol: Q4PIN | package: GSX-431 | Show Device | |
device: GSX-533 library: golledge_jun16a.lbr | Crystal |SM| 5.0 x 3.2 mm | AT cut | Frequency Range 8 - 160 MHz Good frequency perturbation Metal lid can be grounded to minimise EMI Seam seal for excellent long-term stability Tight specifications available Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications Datasheet | Download NowShow Library | ||
variants: | symbol: Q4PIN | package: GSX-531  | Show Device | |
device: LMX9838 library: ns_lmx9838.lbr | Bluetooth Serial Port Module Manufacturer: National Semiconductor Source: http://www.national.com/mpf/LM/LMX9838.html | Download NowShow Library | ||
variants: | symbol: LMX9838  | package: LTCC70  | Show Device | |
device: PAN1740 library: panasonic-pan1740.lbr | Bluetooth Low Energy (BLE), also called Bluetooth Smart, is a part of Bluetooth Ver. 4.0, BT v4.0 covers both BLE as well as Classic Bluetooth v2.1 and v3.0. Bluetooth Low Energy (BLE) is not backwards compatible with previous Classic Bluetooth standards (v2.1+EDR or v3.0). Dual mode Bluetooth v4.0 is targeted to gateway products and backwards compatible, but is not practical for low power devices. The library has been designed by Richard Magdycz | Download NowShow Library | ||
variants: | symbol: PAN1740  | package: PAN1740  | Show Device | |
device: SWRA092B library: texas.lbr | Compact Reach XtendTM Bluetooth®, 802.11b/g WLAN Chip Antenna Source: Data sheet | Download NowShow Library | ||
variants: | symbol: ANTENNA  | package: SWRA092B  | Show Device | |
device: T7024 library: atmel.lbr | Bluetooth/ISM 2.4-GHz Front-End IC Source: http://www.atmel.com/dyn/resources/prod_documents/doc4533.pdf | Download NowShow Library | ||
variants: | symbol: T7024  | package: MLF20-5X5-TH  | Show Device | |
device: T7024 library: atmel.lbr | Bluetooth/ISM 2.4-GHz Front-End IC Source: http://www.atmel.com/dyn/resources/prod_documents/doc4533.pdf | Download NowShow Library | ||
variants: | symbol: T7024  | package: QFN20_5X5_0.65  | Show Device | |
device: TPS623XX library: m-pad-2.1.lbr | Ti's TPS623** 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER Description: The TPS623xx device is a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. Intended for low-power applications, the TPS623xx supports up to 500-mA load current and allows the use of tiny, low cost chip inductor and capacitors. The device is ideal for mobile phones and similar portable applications powered by a single-cell Li-Ion battery or by 3-cell NiMH/NiCd ba ... | Download NowShow Library | ||
variants: | symbol: TPS623XX  | package: QFN-10  | Show Device | |
device: WE-BAL library: wurth_elektronik_passive_rev16d.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL  | package: WE-BAL_0603  | Show Device | |
device: WE-BAL library: wurth_elektronik_passive_rev16d.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_0805  | Show Device | |
device: WE-BAL library: wurth_elektronik_passive_rev16d.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_1206  | Show Device | |
device: WE-BAL library: Wuerth_Elektronik_eiSos_V4.lbr | Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth | Download NowShow Library | ||
variants: | symbol: WE-BAL  | package: WE-BAL_0603  | Show Device | |
device: WE-BAL library: Wuerth_Elektronik_eiSos_V4.lbr | Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_0805  | Show Device | |
device: WE-BAL library: Wuerth_Elektronik_eiSos_V4.lbr | Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_1206  | Show Device | |
device: WE-BAL library: Wuerth_Elektronik_eiSos_V4.lbr | Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth | Download NowShow Library | ||
variants: | symbol: WE-BAL  | package: WE-BAL_0603  | Show Device | |
device: WE-BAL library: Wuerth_Elektronik_eiSos_V4.lbr | Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_0805  | Show Device | |
device: WE-BAL library: Wuerth_Elektronik_eiSos_V4.lbr | Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_1206  | Show Device | |
device: WE-BAL library: Wuerth_Elektronik_eiSos_V6.lbr | Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth | Download NowShow Library | ||
variants: | symbol: WE-BAL  | package: WE-BAL_0603  | Show Device | |
device: WE-BAL library: Wuerth_Elektronik_eiSos_V6.lbr | Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_0805  | Show Device | |
device: WE-BAL library: Wuerth_Elektronik_eiSos_V6.lbr | Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_1206  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15b.lbr | Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Würth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL  | package: WE-BAL_0603  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15b.lbr | Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Würth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_0805  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15b.lbr | Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Würth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_1206  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15c.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL  | package: WE-BAL_0603  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15c.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_0805  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15c.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_1206  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15d.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL  | package: WE-BAL_0603  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15d.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_0805  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15d.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_1206  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15e.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL  | package: WE-BAL_0603  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15e.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_0805  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15e.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_1206  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15f.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL  | package: WE-BAL_0603  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15f.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_0805  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15f.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_1206  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15g.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL  | package: WE-BAL_0603  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15g.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_0805  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15g.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_1206  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15h.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL  | package: WE-BAL_0603  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15h.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_0805  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev15h.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_1206  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev16a.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL  | package: WE-BAL_0603  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev16a.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_0805  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev16a.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_1206  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev16b.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL  | package: WE-BAL_0603  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev16b.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_0805  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev16b.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_1206  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev16c.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL  | package: WE-BAL_0603  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev16c.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_0805  | Show Device | |
device: WE-BAL library: Wurth_Elektronik_Passive_rev16c.lbr | WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: WE-BAL | package: WE-BAL_1206  | Show Device | |
device: WE-BPF_T1/5 library: wurth_elektronik_passive_rev16d.lbr | Multilayer Chip Band-Pass Filter Characteristics Multilayer Chip Band-Pass Filter with low insertion loss and high attenuation SMD component in the sizes 0805 and 1008 Guaranteed filter characteristics over a wide temperature range Applications RF applications Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth … Details see: http://katalog.we-online.de/en/pbs/WE-BPF Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: BPF_T1/T5  | package: WE-BPF_0805_T1  | Show Device | |
device: WE-BPF_T1/5 library: wurth_elektronik_passive_rev16d.lbr | Multilayer Chip Band-Pass Filter Characteristics Multilayer Chip Band-Pass Filter with low insertion loss and high attenuation SMD component in the sizes 0805 and 1008 Guaranteed filter characteristics over a wide temperature range Applications RF applications Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth … Details see: http://katalog.we-online.de/en/pbs/WE-BPF Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: BPF_T1/T5 | package: WE-BPF_1008_T5  | Show Device | |
device: WE-BPF_T1/5 library: wurth_elektronik_passive_rev16d.lbr | Multilayer Chip Band-Pass Filter Characteristics Multilayer Chip Band-Pass Filter with low insertion loss and high attenuation SMD component in the sizes 0805 and 1008 Guaranteed filter characteristics over a wide temperature range Applications RF applications Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth … Details see: http://katalog.we-online.de/en/pbs/WE-BPF Updated by Dan Xu 2014-06-19 2014 (C) Wurth Elektronik | Download NowShow Library | ||
variants: | symbol: BPF_T1/T5 | package: WE-BPF_1206_748333024  | Show Device | |
device: WE-BPF_T1/5 library: Wuerth_Elektronik_eiSos_V4.lbr | SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,.. | Download NowShow Library | ||
variants: | symbol: BPF_T1/T5  | package: WE-BPF_0805_T1  | Show Device | |
device: WE-BPF_T1/5 library: Wuerth_Elektronik_eiSos_V4.lbr | SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,.. | Download NowShow Library | ||
variants: | symbol: BPF_T1/T5 | package: WE-BPF_1008_T5  | Show Device | |
device: WE-BPF_T1/5 library: Wuerth_Elektronik_eiSos_V4.lbr | SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,.. | Download NowShow Library | ||
variants: | symbol: BPF_T1/T5 | package: WE-BPF_1206_T1  | Show Device | |
device: WE-BPF_T1/5 library: Wuerth_Elektronik_eiSos_V4.lbr | SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,.. | Download NowShow Library | ||
variants: | symbol: BPF_T1/T5  | package: WE-BPF_0805_T1  | Show Device | |
device: WE-BPF_T1/5 library: Wuerth_Elektronik_eiSos_V4.lbr | SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,.. | Download NowShow Library | ||
variants: | symbol: BPF_T1/T5 | package: WE-BPF_1008_T5  | Show Device | |
device: WE-BPF_T1/5 library: Wuerth_Elektronik_eiSos_V4.lbr | SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,.. | Download NowShow Library | ||
variants: | symbol: BPF_T1/T5 | package: WE-BPF_1206_T1  | Show Device | |
device: WE-BPF_T1/5 library: Wuerth_Elektronik_eiSos_V6.lbr | SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,.. | Download NowShow Library | ||
variants: | symbol: BPF_T1/T5  | package: WE-BPF_0805_T1  | Show Device | |
device: WE-BPF_T1/5 library: Wuerth_Elektronik_eiSos_V6.lbr | SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,.. | Download NowShow Library | ||
variants: | symbol: BPF_T1/T5 | package: WE-BPF_1008_T5  | Show Device | |
device: WE-BPF_T1/5 library: Wuerth_Elektronik_eiSos_V6.lbr | SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,.. | Download NowShow Library | ||
variants: | symbol: BPF_T1/T5 | package: WE-BPF_1206_T1  | Show Device | |
device: WE-BPF_T1/5 library: Wurth_Elektronik_Passive_rev15b.lbr | SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,.. Details see: http://katalog.we-online.de/en/pbs/WE-BPF Updated by Dan Xu 2014-06-19 2014 (C) Würth Elektronik | Download NowShow Library | ||
variants: | symbol: BPF_T1/T5  | package: WE-BPF_0805_T1  | Show Device | |
device: WE-BPF_T1/5 library: Wurth_Elektronik_Passive_rev15b.lbr | SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,.. Details see: http://katalog.we-online.de/en/pbs/WE-BPF Updated by Dan Xu 2014-06-19 2014 (C) Würth Elektronik | Download NowShow Library | ||
variants: | symbol: BPF_T1/T5 | package: WE-BPF_1008_T5  | Show Device | |
device: WE-BPF_T1/5 library: Wurth_Elektronik_Passive_rev15b.lbr | SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,.. Details see: http://katalog.we-online.de/en/pbs/WE-BPF Updated by Dan Xu 2014-06-19 2014 (C) Würth Elektronik | Download NowShow Library | ||
variants: | symbol: BPF_T1/T5 | package: WE-BPF_1206_T1  | Show Device | |