Facebook Official Page

www.facebook.com/DIYmodules

Share EAGLE library

Have you created EAGLE library?
Did you find an interesting library?
Why not share with the community?

More...

News

2017-07-02

DIY Modules Eagle Library version 1.8.0 has been released.

2017-05-20

DIY Modules Eagle Library version 1.7.0 has been released.

2017-05-03

DIY Modules Eagle Library version 1.6.0 has been released.

More news...

  • Home
  • Seach Engine for EAGLE Libraries

Search Engine for EAGLE Libraries

Search

Specify what you are looking for:

Search for:

Object type:DeviceSymbolPackage

Library source:Published by DIYmodules.org

Uploaded by DIYmodules.org visitors

Shared by users

Built-in libraries

Options:Serach in descriptions

Results

We have found a lot of matching records.
First 100 records are listed below:

Device / variantSymbolPackageAction

device: BC118

library: blue-creation-bc118.lbr

BC118 is a highly flexible, ultra low power, small form factor Bluetooth Version 4.0 Certified module. Bluetooth Certified 4.0 Audio module  Single Mode: Bluetooth Low Energy (BLE)  Embedded Bluetooth Protocol Stack  Supports GATT Profile, Audio, Proximity, and iBeacon  Supports I2C and UART transparent Data Modes  Simple UART and GPIO interface for command and control  Small form factor (14.4mm x 19.3mm x 2.2mm)  Bluetooth, FCC and CE certified The library has been designed ...Download NowShow Library

variants:

BC118

symbol: BC118

Preview

package: BC118

Preview
Show Device

device: BC358239A

library: csr.lbr

BlueCore TM 3-Multuimedia Single Chip Bluetooth® v1.2 System Auto generated by make-symbol-device-package-bsdl.ulp Rev. 19 Source: http://www.csrsupport.com/download/1796/CS-101560-DSP1%20BlueCore3-Multimedia%20Product%20Data%20Sheet.pdfDownload NowShow Library

variants:

BC358239A

symbol: BC358239A

Preview

package: LFBGA96

Preview
Show Device

device: BLUEGIGA_WT11

library: m-pad-2.1.lbr

BlueGiga's WT11 Bluetooth Module (2.0+EDR) Description: BlueCore4 is a single chip Bluetooth solution which implements the Bluetooth radio transceiver and also an on chip microcontroller. BlueCore4 implements Bluetooth® 2.0+EDR (Enhanced Data Rate) and it can deliver data rates up to 3 Mbps. The microcontroller (MCU) on BlueCore04 acts as interrupt controller and event timer run the Bluetooth software stack and control the radio and host interfaces. A 16-bit reduced instruction set comp ...Download NowShow Library

variants:

BLUEGIGA_WT11

symbol: BLUEGIGA_WT11

Preview

package: WT11

Preview
Show Device

device: BLUEGIGA_WT12

library: m-pad-2.1.lbr

BlueGiga's WT12 Bluetooth Module (2.0+EDR) Description: BlueCore4 is a single chip Bluetooth solution which implements the Bluetooth radio transceiver and also an on chip microcontroller. BlueCore4 implements Bluetooth® 2.0+EDR (Enhanced Data Rate) and it can deliver data rates up to 3 Mbps. The microcontroller (MCU) on BlueCore04 acts as interrupt controller and event timer run the Bluetooth software stack and control the radio and host interfaces. A 16-bit reduced instruction set comp ...Download NowShow Library

variants:

BLUEGIGA_WT12W

symbol: BLUEGIGA_WT12

Preview

package: WT12

Preview
Show Device

device: BR-C30A

library: m-pad-2.1.lbr

Blue Radio's BR-C30 Class1, Class2, and Class3 Bluetooth® ver1.2 OUTLINE: AT HOME. AT WORK. ON THE ROAD. USING BLUETOOTH WIRELESS TECHNOLOGY MEANS TOTAL FREEDOM FROM THE CONSTRAINTS AND CLUTTER OF WIRES IN YOUR LIFE. Wireless communications module certified to Bluetooth® v1.2. Two types of models: With/without ceramic RF chip antenna provided. FCC, CE, Industry Canada, RoHS, and Bluetooth® certified ISM 2.4GHz band module. UART data, and PCM audio interfaces available to various appli ...Download NowShow Library

variants:

BR-C30A

symbol: BR-C30A

Preview

package: BR-C30A

Preview
Show Device

device: BTM-110-112

library: rayson__btm_bluetooth_modul.lbr

The module is a Max.4dBm( Class2 ) module. Bluetooth standard Ver. 2.0 + EDR conformity. Internal 1.8V regulator Low current consumption : Hold,Sniff,Park,Deep sleep Mode 3.0v to 3.6v operation Support for up to seven slaves : SCO links,ACL links,Piconet Interface: USB,UART&PCM(for voice CODEC) SPP firmware with AT command sets Small outline. 25 x 14.5 x 2.2 mmDownload NowShow Library

variants:

BTM-110-112

symbol: BTM-110-112

Preview

package: BTM-112

Preview
Show Device

device: BTM-180

library: rayson__btm_bluetooth_modul.lbr

The module is a Max.4dBm( Class2 ) module with antenna Bluetooth standard Ver. 2.0 + EDR compliant. Low current consumption : Hold,Sniff,Park,Deep sleep Mode 3.0V or 1.8V operation Support for up to seven slaves : SCO links,ACL links,Piconet Interface: USB,UART&PCM(for voice CODEC) HCI or SPP,HSP/HFP,HID,DUN firmware is available Support for 802.11 Co-Exsitence RoHS compliant Small outline. 25.0 x 14.5 x 2.2 mmDownload NowShow Library

variants:

BTM-180

symbol: BTM-180

Preview

package: BTM-180

Preview
Show Device

device: BTM-220-222

library: rayson__btm_bluetooth_modul.lbr

Rayson BTM-222 Bluetooth Modul all PinsDownload NowShow Library

variants:

BTM-220-222

symbol: BTM-220-222

Preview

package: BTM-220-222

Preview
Show Device

device: BTM-220-222-SERIAL

library: rayson__btm_bluetooth_modul.lbr

Rayson BTM-222 Bluetooth Modul Serial PinsDownload NowShow Library

variants:

BTM-220-222-SERIAL

symbol: BTM-220-222-SERIAL

Preview

package: BTM-220-222

Preview
Show Device

device: BTM-222

library: btm-222.lbr

Rayson BTM-222 Bluetooth Modul all PinsDownload NowShow Library

variants:

BTM-222

symbol: BTM-222

Preview

package: BTM-222

Preview
Show Device

device: BTM-222-SERIAL

library: btm-222.lbr

Rayson BTM-222 Bluetooth Modul Serial PinsDownload NowShow Library

variants:

BTM-222-SERIAL

symbol: BTM-222-SERIAL

Preview

package: BTM-222

Preview
Show Device

device: BTM-230

library: rayson__btm_bluetooth_modul.lbr

BC04-EXT Class1 Module The module is a Max.17dBm( Class1 ) module. Bluetooth v2.0+EDR system. 3.0V to 3.6V operation Interface: USB, UART&PCM( for voice codec) Integrated with 8M bits flash memory. Integrated chip antenna SPP firmware with AT commands RoHS compliant. Small outline. 35.3 x 14 x 2.5 mm.Download NowShow Library

variants:

BTM-230

symbol: BTM-230

Preview

package: BTM-230

Preview
Show Device

device: BTM-240/250

library: rayson__btm_bluetooth_modul.lbr

BC03-mm Class1 Stereo Module The module is a Max.18dBm( Class1 ) module. Bluetooth standard Ver. 2.0 conformity. Low current consumption 3.0V or 1.8V operation Embedded Kalimba DSP Co-Processor Integrated 16-bit Stereo Audio CODEC Scatternet Support Interface: USB,UART&PCM(for voice CODEC) Support Digital Audio Bus : I2S or SPDIF Headset/Handsfree firmware is available A2DP/AVRCP profile support RoHS compliant Small outline. 16 x 14 x 2.0 mmDownload NowShow Library

variants:

BTM-240/250

symbol: BTM-240/250

Preview

package: BTM-240/250

Preview
Show Device

device: BTM-331

library: rayson__btm_bluetooth_modul.lbr

Bluetooth ®Module Class2 BC04-rom HCI ModuleDownload NowShow Library

variants:

BTM-331

symbol: BTM-331

Preview

package: BTM-331

Preview
Show Device

device: BTM-620

library: rayson__btm_bluetooth_modul.lbr

The module is a Max.18dBm( Class 1 ) module. Bluetooth Standard v2.1+EDR. Integrated Switched-Mode Regulator. Integrated Battery Charger. Embedded Kalimba DSP Co-Processor. Integrated 16-bit Stereo Audio CODEC 95dB SNR for DAC. Enhanced Audibility and Noise Cancellation. Integrated with 8M bits flash memory. Support Host Interface: USB or UART. Support Digital Audio Bus : PCM, I2S or SPDIF. HSP/HFP/A2DP/AVRCP profiles support. RoHS compliant. Small outline. 21 x 16 x 2 mm.Download NowShow Library

variants:

BTM-620

symbol: BTM-620

Preview

package: BTM-620

Preview
Show Device

device: BTM-720

library: rayson__btm_bluetooth_modul.lbr

The module is a Max.4dBm( Class2 ) module. Fully Qualified Bluetooth v2.0+EDR system. Integrated Switched-Mode Regulator. Integrated Battery Charger. Embedded Kalimba DSP Co-Processor. Integrated 16-bit Stereo Audio CODEC 95dB SNR for DAC. Enhanced Audibility and Noise Cancellation. Integrated with 16M bits flash memory. Support Host Interface: USB or UART. Support Digital Audio Bus : PCM, I2S or SPDIF. HSP/HFP/A2DP/AVRCP profiles support. RoHS compliant. Small outline. 16 x 15 x ...Download NowShow Library

variants:

BTM-720

symbol: BTM-720

Preview

package: BTM-720-730-740

Preview
Show Device

device: BTM-730/740

library: rayson__btm_bluetooth_modul.lbr

The module is a Max.4dBm( Class2 ) module. Fully Qualified Bluetooth v2.0+EDR system. Integrated Switched-Mode Regulator. Integrated Battery Charger. Embedded Kalimba DSP Co-Processor. Integrated 16-bit Stereo Audio CODEC 95dB SNR for DAC. Enhanced Audibility and Noise Cancellation. Integrated with 8M bits flash memory. Support Host Interface: USB or UART. Support Digital Audio Bus : PCM, I2S or SPDIF. HSP/HFP/A2DP/AVRCP profiles support. RoHS compliant. Small outline. 16 x 15 x ...Download NowShow Library

variants:

BTM-730/740

symbol: BTM-730/740

Preview

package: BTM-720-730-740

Preview
Show Device

device: BTM-750

library: rayson__btm_bluetooth_modul.lbr

The module is a Max.4dBm( Class2 ) module. Fully Qualified Bluetooth v2.1+EDR system. Integrated Switched-Mode Regulator. Integrated Battery Charger. Embedded Kalimba DSP Co-Processor. Integrated 16-bit Stereo Audio CODEC 95dB SNR for DAC. Enhanced Audibility and Noise Cancellation. Integrated with 8M bits flash memory. Support Host Interface: USB or UART. Support Digital Audio Bus : PCM, I2S or SPDIF. HSP/HFP/A2DP/AVRCP profiles support. Integrated chip antenna ( or W.FL connecto ...Download NowShow Library

variants:

BTM-750

symbol: BTM-750

Preview

package: BTM-750

Preview
Show Device

device: CC2540

library: texas.lbr

2.4-GHz Bluetooth® low energy System-on-Chip Auto generated by make-symbol-device-package-bsdl.ulp Rev. 39 Source: cc2540.txtDownload NowShow Library

variants:

CC2540

symbol: CC2540

Preview

symbol: EXP-16

Preview

package: QFN40-6X6

Preview
Show Device

device: CC2540F*

library: _hhn_CC2540F_BluetoothSOC_r500.lbr

CC2540F128 / CCF254F256 Texas Instruments 2.4-GHz Bluetooth® low Energy System-on-Chip Package: QFN406x6mm (TI-Postifx "RHA") Dipl.-Ing. FH Rainer Bayer Hochschule Heilbronn – rainer.bayer@hs-heilbronn.de Ingenieurbüro ing-rb – eagle@ing-rb.deDownload NowShow Library

variants:

CC2540F128RHA

CC2540F256RHA

symbol: CC2540F128_F256

Preview

package: QFN40-6X6

Preview
Show Device

device: CC2541

library: texas-cc2541.lbr

The CC2541 is a power-optimized true system-on-chip (SoC) solution for both Bluetooth low energy and proprietary 2.4-GHz applications. It enables robust network nodes to be built with low total bill-of-material costs. The CC2541 combines the excellent performance of a leading RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8-KB RAM, and many other powerful supporting features and peripherals. The library has been designed by Richard MagdyczDownload NowShow Library

variants:

CC2541

symbol: CC2541

Preview

package: QFN40-6X6

Preview
Show Device

device: GSX-211

library: golledge.lbr

Crystal |SM| 1.6 x 1.2 x 0.45mm | Frequency Range: 24.0-54.0MHz Ultra-miniature for maximum space saving Ideal for Bluetooth, NFC, Smartcard, wireless, wearables etc Metal lid grounded to minimise EMI Seam sealed for excellent long-term stability Datasheet and Purchasing InformationDownload NowShow Library

variants:

GSX-211

symbol: Q4PIN

Preview

package: GSX-211

Preview
Show Device

device: GSX-211

library: golledge_full_v1-0.lbr

Crystal |SM| 1.6 x 1.2 mm | AT cut | Frequency Range 24 - 54 MHz Ultra-miniature for maximum space saving Ideal for Bluetooth, NFC, Smartcard, wireless etc Metal lid grounded to minimise EMI Seam sealed for excellent long-term stability DatasheetDownload NowShow Library

variants:

GSX-211

symbol: Q4PIN

Preview

package: GSX-211

Preview
Show Device

device: GSX-211

library: golledge_jun16a.lbr

Crystal |SM| 1.6 x 1.2 mm | AT cut | Frequency Range 24 - 54 MHz Ultra-miniature for maximum space saving Ideal for Bluetooth, NFC, Smartcard, wireless etc Metal lid grounded to minimise EMI Seam sealed for excellent long-term stability DatasheetDownload NowShow Library

variants:

GSX-211

symbol: Q4PIN

Preview

package: GSX-211

Preview
Show Device

device: GSX-213

library: golledge_jun16a.lbr

Crystal |SM| 1.6 x 1.2 mm | AT cut | Frequency Range 26 - 60 MHz Ultra-miniature for maximum space saving Ideal for Bluetooth, NFC, Smartcard, wireless etc Metal lid grounded to minimise EMI Seam sealed for excellent long-term stability DatasheetDownload NowShow Library

variants:

GSX-213

symbol: Q4PIN

Preview

package: GSX-211

Preview
Show Device

device: GSX-221

library: golledge.lbr

Crystal |SM| 2.0 x 1.6 x 0.55mm | Frequency Range: 16.0 - 56.0MHz Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications High reliability & tight stability Metal lid can be grounded to minimise EMI Seam sealed for excellent long-term stability Datasheet and Purchasing InformationDownload NowShow Library

variants:

GSX-221

symbol: Q4PIN

Preview

package: GSX-221

Preview
Show Device

device: GSX-221

library: golledge_full_v1-0.lbr

Crystal |SM| 2.0 x 1.6 mm | AT cut | Frequency Range 16 - 56 MHz Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications High reliability & tight stability Metal lid can be grounded to minimise EMI Seam sealed for excellent long-term stability DatasheetDownload NowShow Library

variants:

GSX-221

symbol: Q4PIN

Preview

package: GSX-221

Preview
Show Device

device: GSX-221

library: golledge_jun16a.lbr

Crystal |SM| 2.0 x 1.6 mm | AT cut | Frequency Range 16 - 56 MHz Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications High reliability & tight stability Metal lid can be grounded to minimise EMI Seam sealed for excellent long-term stability DatasheetDownload NowShow Library

variants:

GSX-221

symbol: Q4PIN

Preview

package: GSX-221

Preview
Show Device

device: GSX-223

library: golledge_jun16a.lbr

Crystal |SM| 2.0 x 1.6 mm | AT cut | Frequency Range 16 - 50 MHz Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications Metal lid can be grounded to minimise EMI Seam sealed for excellent long-term stability DatasheetDownload NowShow Library

variants:

GSX-223

symbol: Q4PIN

Preview

package: GSX-221

Preview
Show Device

device: GSX-321

library: golledge_full_v1-0.lbr

Crystal |SM| 2.5 x 2.0 mm | AT cut | Frequency Range 12 - 66 MHz Tight specification / wide temperature option Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications Metal lid grounded to minimise EMI Seam sealed for excellent long-term stability DatasheetDownload NowShow Library

variants:

GSX-321

symbol: Q4PIN

Preview

package: OSC2520

Preview
Show Device

device: GSX-321

library: golledge_jun16a.lbr

Crystal |SM| 2.5 x 2.0 mm | AT cut | Frequency Range 12 - 66 MHz Tight specification / wide temperature option Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications Metal lid grounded to minimise EMI Seam sealed for excellent long-term stability DatasheetDownload NowShow Library

variants:

GSX-321

symbol: Q4PIN

Preview

package: OSC2520

Preview
Show Device

device: GSX-323

library: golledge_jun16a.lbr

Crystal |SM| 2.5 x 2.0 mm | AT cut | Frequency Range 12 - 54 MHz Ideal for Bluetooth / Wireless applications Seam sealed for excellent long-term stability Ultra-miniature for maximum space saving Metal lid grounded to minimise EMI DatasheetDownload NowShow Library

variants:

GSX-323

symbol: Q4PIN

Preview

package: OSC2520

Preview
Show Device

device: GSX-333

library: golledge_jun16a.lbr

Crystal |SM| 3.2 x 2.5 mm | AT cut | Frequency Range 12 - 125 MHz Metal lid can be grounded to minimise EMI Seam sealed for excellent long-term stability Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications DatasheetDownload NowShow Library

variants:

GSX-333

symbol: Q4PIN

Preview

package: OSC3225

Preview
Show Device

device: GSX-431

library: golledge_full_v1-0.lbr

Crystal |SM| 4.0 x 2.5 mm | AT cut | Frequency Range 13 - 32 MHz Metal lid can be grounded to minimise EMI Seam sealed for excellent stability Ultra-miniature for maximum space saving Ideal for Bluetooth applications DatasheetDownload NowShow Library

variants:

GSX-431

symbol: Q4PIN

Preview

package: GSX-431

Preview
Show Device

device: GSX-431

library: golledge_jun16a.lbr

Crystal |SM| 4.0 x 2.5 mm | AT cut | Frequency Range 13 - 32 MHz Metal lid can be grounded to minimise EMI Seam sealed for excellent stability Ultra-miniature for maximum space saving Ideal for Bluetooth applications DatasheetDownload NowShow Library

variants:

GSX-431

symbol: Q4PIN

Preview

package: GSX-431

Preview
Show Device

device: GSX-433

library: golledge_jun16a.lbr

Crystal |SM| 4.0 x 2.5 mm | AT cut | Frequency Range 12 - 44 MHz Good frequency perturbation Metal lid can be grounded to minimise EMI Seam sealed for excellent stability Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications DatasheetDownload NowShow Library

variants:

GSX-433

symbol: Q4PIN

Preview

package: GSX-431

Preview
Show Device

device: GSX-533

library: golledge_jun16a.lbr

Crystal |SM| 5.0 x 3.2 mm | AT cut | Frequency Range 8 - 160 MHz Good frequency perturbation Metal lid can be grounded to minimise EMI Seam seal for excellent long-term stability Tight specifications available Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications DatasheetDownload NowShow Library

variants:

GSX-533

symbol: Q4PIN

Preview

package: GSX-531

Preview
Show Device

device: LMX9838

library: ns_lmx9838.lbr

Bluetooth Serial Port Module Manufacturer: National Semiconductor Source: http://www.national.com/mpf/LM/LMX9838.htmlDownload NowShow Library

variants:

LMX9838

symbol: LMX9838

Preview

package: LTCC70

Preview
Show Device

device: PAN1740

library: panasonic-pan1740.lbr

Bluetooth Low Energy (BLE), also called Bluetooth Smart, is a part of Bluetooth Ver. 4.0, BT v4.0 covers both BLE as well as Classic Bluetooth v2.1 and v3.0. Bluetooth Low Energy (BLE) is not backwards compatible with previous Classic Bluetooth standards (v2.1+EDR or v3.0). Dual mode Bluetooth v4.0 is targeted to gateway products and backwards compatible, but is not practical for low power devices. The library has been designed by Richard MagdyczDownload NowShow Library

variants:

PAN1740

symbol: PAN1740

Preview

package: PAN1740

Preview
Show Device

device: SWRA092B

library: texas.lbr

Compact Reach XtendTM Bluetooth®, 802.11b/g WLAN Chip Antenna Source: Data sheet Download NowShow Library

variants:

SWRA092B

symbol: ANTENNA

Preview

package: SWRA092B

Preview
Show Device

device: T7024

library: atmel.lbr

Bluetooth/ISM 2.4-GHz Front-End IC Source: http://www.atmel.com/dyn/resources/prod_documents/doc4533.pdfDownload NowShow Library

variants:

T7024

symbol: T7024

Preview

package: MLF20-5X5-TH

Preview
Show Device

device: TPS623XX

library: m-pad-2.1.lbr

Ti's TPS623** 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER Description: The TPS623xx device is a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. Intended for low-power applications, the TPS623xx supports up to 500-mA load current and allows the use of tiny, low cost chip inductor and capacitors. The device is ideal for mobile phones and similar portable applications powered by a single-cell Li-Ion battery or by 3-cell NiMH/NiCd ba ...Download NowShow Library

variants:

TPS623XX

symbol: TPS623XX

Preview

package: QFN-10

Preview
Show Device

device: WE-BAL

library: wurth_elektronik_passive_rev16d.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0603

symbol: WE-BAL

Preview

package: WE-BAL_0603

Preview
Show Device

device: WE-BAL

library: wurth_elektronik_passive_rev16d.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0805

symbol: WE-BAL

Preview

package: WE-BAL_0805

Preview
Show Device

device: WE-BAL

library: wurth_elektronik_passive_rev16d.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_1206

symbol: WE-BAL

Preview

package: WE-BAL_1206

Preview
Show Device

device: WE-BAL

library: Wuerth_Elektronik_eiSos_V4.lbr

Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, BluetoothDownload NowShow Library

variants:

WE-BAL_0603

symbol: WE-BAL

Preview

package: WE-BAL_0603

Preview
Show Device

device: WE-BAL

library: Wuerth_Elektronik_eiSos_V4.lbr

Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, BluetoothDownload NowShow Library

variants:

WE-BAL_0805

symbol: WE-BAL

Preview

package: WE-BAL_0805

Preview
Show Device

device: WE-BAL

library: Wuerth_Elektronik_eiSos_V4.lbr

Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, BluetoothDownload NowShow Library

variants:

WE-BAL_1206

symbol: WE-BAL

Preview

package: WE-BAL_1206

Preview
Show Device

device: WE-BAL

library: Wuerth_Elektronik_eiSos_V4.lbr

Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, BluetoothDownload NowShow Library

variants:

WE-BAL_0603

symbol: WE-BAL

Preview

package: WE-BAL_0603

Preview
Show Device

device: WE-BAL

library: Wuerth_Elektronik_eiSos_V4.lbr

Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, BluetoothDownload NowShow Library

variants:

WE-BAL_0805

symbol: WE-BAL

Preview

package: WE-BAL_0805

Preview
Show Device

device: WE-BAL

library: Wuerth_Elektronik_eiSos_V4.lbr

Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, BluetoothDownload NowShow Library

variants:

WE-BAL_1206

symbol: WE-BAL

Preview

package: WE-BAL_1206

Preview
Show Device

device: WE-BAL

library: Wuerth_Elektronik_eiSos_V6.lbr

Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, BluetoothDownload NowShow Library

variants:

WE-BAL_0603

symbol: WE-BAL

Preview

package: WE-BAL_0603

Preview
Show Device

device: WE-BAL

library: Wuerth_Elektronik_eiSos_V6.lbr

Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, BluetoothDownload NowShow Library

variants:

WE-BAL_0805

symbol: WE-BAL

Preview

package: WE-BAL_0805

Preview
Show Device

device: WE-BAL

library: Wuerth_Elektronik_eiSos_V6.lbr

Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, BluetoothDownload NowShow Library

variants:

WE-BAL_1206

symbol: WE-BAL

Preview

package: WE-BAL_1206

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15b.lbr

Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Würth ElektronikDownload NowShow Library

variants:

WE-BAL_0603

symbol: WE-BAL

Preview

package: WE-BAL_0603

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15b.lbr

Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Würth ElektronikDownload NowShow Library

variants:

WE-BAL_0805

symbol: WE-BAL

Preview

package: WE-BAL_0805

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15b.lbr

Multilayer Chip Baluns WE-BAL - Low loss SMD Balun with balanced impedance of 50 to 200 Ohm - Operating temperature: -40°C to +85°C - Power Capacity: 3 W max. -- RF-applications in the area of 0.8 to 6 GHz -- Download S-Parameter on www.we-online.com -- Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Würth ElektronikDownload NowShow Library

variants:

WE-BAL_1206

symbol: WE-BAL

Preview

package: WE-BAL_1206

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15c.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0603

symbol: WE-BAL

Preview

package: WE-BAL_0603

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15c.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0805

symbol: WE-BAL

Preview

package: WE-BAL_0805

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15c.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_1206

symbol: WE-BAL

Preview

package: WE-BAL_1206

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15d.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0603

symbol: WE-BAL

Preview

package: WE-BAL_0603

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15d.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0805

symbol: WE-BAL

Preview

package: WE-BAL_0805

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15d.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_1206

symbol: WE-BAL

Preview

package: WE-BAL_1206

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15e.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0603

symbol: WE-BAL

Preview

package: WE-BAL_0603

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15e.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0805

symbol: WE-BAL

Preview

package: WE-BAL_0805

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15e.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_1206

symbol: WE-BAL

Preview

package: WE-BAL_1206

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15f.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0603

symbol: WE-BAL

Preview

package: WE-BAL_0603

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15f.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0805

symbol: WE-BAL

Preview

package: WE-BAL_0805

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15f.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_1206

symbol: WE-BAL

Preview

package: WE-BAL_1206

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15g.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0603

symbol: WE-BAL

Preview

package: WE-BAL_0603

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15g.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0805

symbol: WE-BAL

Preview

package: WE-BAL_0805

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15g.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_1206

symbol: WE-BAL

Preview

package: WE-BAL_1206

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15h.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0603

symbol: WE-BAL

Preview

package: WE-BAL_0603

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15h.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0805

symbol: WE-BAL

Preview

package: WE-BAL_0805

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev15h.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_1206

symbol: WE-BAL

Preview

package: WE-BAL_1206

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev16a.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0603

symbol: WE-BAL

Preview

package: WE-BAL_0603

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev16a.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0805

symbol: WE-BAL

Preview

package: WE-BAL_0805

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev16a.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_1206

symbol: WE-BAL

Preview

package: WE-BAL_1206

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev16b.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0603

symbol: WE-BAL

Preview

package: WE-BAL_0603

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev16b.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0805

symbol: WE-BAL

Preview

package: WE-BAL_0805

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev16b.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_1206

symbol: WE-BAL

Preview

package: WE-BAL_1206

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev16c.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0603

symbol: WE-BAL

Preview

package: WE-BAL_0603

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev16c.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_0805

symbol: WE-BAL

Preview

package: WE-BAL_0805

Preview
Show Device

device: WE-BAL

library: Wurth_Elektronik_Passive_rev16c.lbr

WE-BAL Multilayer Chip Balun Characteristics Low loss SMD Balun with balanced impedance of 50 to 200 Ω Operating temperature: –40 °C to +85 °C Power Capacity: 2 W max. Applications RF applications Wireless communication systems like Home RF, DECT, WLAN, Bluetooth, ZigBee … Details see: http://katalog.we-online.de/en/pbs/WE-BAL Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BAL_1206

symbol: WE-BAL

Preview

package: WE-BAL_1206

Preview
Show Device

device: WE-BPF_T1/5

library: wurth_elektronik_passive_rev16d.lbr

Multilayer Chip Band-Pass Filter Characteristics Multilayer Chip Band-Pass Filter with low insertion loss and high attenuation SMD component in the sizes 0805 and 1008 Guaranteed filter characteristics over a wide temperature range Applications RF applications Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth … Details see: http://katalog.we-online.de/en/pbs/WE-BPF Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BPF_T1/5_0805

symbol: BPF_T1/T5

Preview

package: WE-BPF_0805_T1

Preview
Show Device

device: WE-BPF_T1/5

library: wurth_elektronik_passive_rev16d.lbr

Multilayer Chip Band-Pass Filter Characteristics Multilayer Chip Band-Pass Filter with low insertion loss and high attenuation SMD component in the sizes 0805 and 1008 Guaranteed filter characteristics over a wide temperature range Applications RF applications Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth … Details see: http://katalog.we-online.de/en/pbs/WE-BPF Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BPF_T1/5_1008

symbol: BPF_T1/T5

Preview

package: WE-BPF_1008_T5

Preview
Show Device

device: WE-BPF_T1/5

library: wurth_elektronik_passive_rev16d.lbr

Multilayer Chip Band-Pass Filter Characteristics Multilayer Chip Band-Pass Filter with low insertion loss and high attenuation SMD component in the sizes 0805 and 1008 Guaranteed filter characteristics over a wide temperature range Applications RF applications Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth … Details see: http://katalog.we-online.de/en/pbs/WE-BPF Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BPF_T1/5_1206

symbol: BPF_T1/T5

Preview

package: WE-BPF_1206_748333024

Preview
Show Device

device: WE-BPF_T1/5

library: Wuerth_Elektronik_eiSos_V4.lbr

SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,..Download NowShow Library

variants:

WE-BPF_T1/5_0805

symbol: BPF_T1/T5

Preview

package: WE-BPF_0805_T1

Preview
Show Device

device: WE-BPF_T1/5

library: Wuerth_Elektronik_eiSos_V4.lbr

SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,..Download NowShow Library

variants:

WE-BPF_T1/5_1008

symbol: BPF_T1/T5

Preview

package: WE-BPF_1008_T5

Preview
Show Device

device: WE-BPF_T1/5

library: Wuerth_Elektronik_eiSos_V4.lbr

SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,..Download NowShow Library

variants:

WE-BPF_T1/5_1206

symbol: BPF_T1/T5

Preview

package: WE-BPF_1206_T1

Preview
Show Device

device: WE-BPF_T1/5

library: Wuerth_Elektronik_eiSos_V4.lbr

SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,..Download NowShow Library

variants:

WE-BPF_T1/5_0805

symbol: BPF_T1/T5

Preview

package: WE-BPF_0805_T1

Preview
Show Device

device: WE-BPF_T1/5

library: Wuerth_Elektronik_eiSos_V4.lbr

SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,..Download NowShow Library

variants:

WE-BPF_T1/5_1008

symbol: BPF_T1/T5

Preview

package: WE-BPF_1008_T5

Preview
Show Device

device: WE-BPF_T1/5

library: Wuerth_Elektronik_eiSos_V4.lbr

SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,..Download NowShow Library

variants:

WE-BPF_T1/5_1206

symbol: BPF_T1/T5

Preview

package: WE-BPF_1206_T1

Preview
Show Device

device: WE-BPF_T1/5

library: Wuerth_Elektronik_eiSos_V6.lbr

SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,..Download NowShow Library

variants:

WE-BPF_T1/5_0805

symbol: BPF_T1/T5

Preview

package: WE-BPF_0805_T1

Preview
Show Device

device: WE-BPF_T1/5

library: Wuerth_Elektronik_eiSos_V6.lbr

SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,..Download NowShow Library

variants:

WE-BPF_T1/5_1008

symbol: BPF_T1/T5

Preview

package: WE-BPF_1008_T5

Preview
Show Device

device: WE-BPF_T1/5

library: Wuerth_Elektronik_eiSos_V6.lbr

SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,..Download NowShow Library

variants:

WE-BPF_T1/5_1206

symbol: BPF_T1/T5

Preview

package: WE-BPF_1206_T1

Preview
Show Device

device: WE-BPF_T1/5

library: Wurth_Elektronik_Passive_rev15b.lbr

SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,.. Details see: http://katalog.we-online.de/en/pbs/WE-BPF Updated by Dan Xu 2014-06-19 2014 (C) Würth ElektronikDownload NowShow Library

variants:

WE-BPF_T1/5_0805

symbol: BPF_T1/T5

Preview

package: WE-BPF_0805_T1

Preview
Show Device

device: WE-BPF_T1/5

library: Wurth_Elektronik_Passive_rev15b.lbr

SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,.. Details see: http://katalog.we-online.de/en/pbs/WE-BPF Updated by Dan Xu 2014-06-19 2014 (C) Würth ElektronikDownload NowShow Library

variants:

WE-BPF_T1/5_1008

symbol: BPF_T1/T5

Preview

package: WE-BPF_1008_T5

Preview
Show Device

device: WE-BPF_T1/5

library: Wurth_Elektronik_Passive_rev15b.lbr

SMD-Multilayer Chip Band-Pass Filter WE-BPF - low insertion loss - High attenuation - Guaranteed filter characteristics over a wide temperature range -- Rf applications in the frequency range up to 6GHz -- Wireless communcation systems like DECT, PACS, PHS, GSM,WLAN,Bluetooth,.. Details see: http://katalog.we-online.de/en/pbs/WE-BPF Updated by Dan Xu 2014-06-19 2014 (C) Würth ElektronikDownload NowShow Library

variants:

WE-BPF_T1/5_1206

symbol: BPF_T1/T5

Preview

package: WE-BPF_1206_T1

Preview
Show Device

device: WE-BPF_T1/5

library: Wurth_Elektronik_Passive_rev15c.lbr

Multilayer Chip Band-Pass Filter Characteristics Multilayer Chip Band-Pass Filter with low insertion loss and high attenuation SMD component in the sizes 0805 and 1008 Guaranteed filter characteristics over a wide temperature range Applications RF applications Wireless communication systems like DECT, PACS, PHS, GSM, WLAN, Bluetooth … Details see: http://katalog.we-online.de/en/pbs/WE-BPF Updated by Dan Xu 2014-06-19 2014 (C) Wurth ElektronikDownload NowShow Library

variants:

WE-BPF_T1/5_0805

symbol: BPF_T1/T5

Preview

package: WE-BPF_0805_T1

Preview
Show Device
Copyright © 2015-2017 DIYmodules.org|Contact webmaster
Our website uses icons made by www.icondrawer.com